Chapter 1: Flex Circuit Design Guide for Static and Dynamic Flexing
By Werner Engelmaier

Author background: Werner Engelmaier has over 43 years of experience in electronic packaging and interconnection technology. Known as “Mr. Reliability,” he is the president of Engelmaier Associates, L.C., a firm providing consulting services on reliability, quality aspects of electronic packaging and interconnection technology. Prior to that, he was a Distinguished Technical Staff at Bell Labs for 24 years.

Chapter 2: Process Challenges and System Applications in Flex
By Kevin M. Durocher and William E. Burdick, GE Research

Author backgrounds: Kevin Durocher, Process Development Engineer, GE CRD BS, Chemistry, University of New York at Albany
Kevin Durocher joined the General Electric Corporate Research and Development Electronic Systems and Technology Lab in 1984 and has been actively involved in several advanced electronic packaging, semiconductor development, and MEMS programs. He is currently a process development engineer on programs for various GE businesses that utilize thin film passives, optical devices, and high resolution flex circuits. Mr. Durocher has coauthored eight papers in the area of electronic thin
films and has a total of 31 issued U.S. patents.

Chapter 3: Flexible Circuit Assembly (A rework of Chapter 7 of Flexible Circuit Technology Third Edition

Author background: Bob Willis currently operates a training and consultancy business based in England. He is the Technical Manager of the SMART Group and a member of
the technical committee. Although a specialist for companies implementing Surface Mount Technology, Bob provides training and consultancy in most areas of electronic manufacture, in the last 10 years focusing on lead-free manufacture, which has earned him the SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution to the industry. He has worked with the GEC Technical Directorate as Surface Mount Coordinator for both Marconi and GEC; prior to that, he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship.

Chapter 4: Solderless Assembly Processes for Flexible Circuits

Author background: Joseph Fjelstad, founder of Verdant Electronics, is a 35-year veteran of the electronics inter-connection industry and international authority, author, columnist, lecturer and innovator with more than 150 issued and pending US patents in the field. He is co-founder and CEO of SiliconPipe, a leader in high-speed interconnection architecture
design—much of it, not surprisingly, based on flexible circuit technology. Prior to founding SiliconPipe, he was with IC package technology developer Tessera Technologies, where he was appointed the company’s first fellow.