Chapter 12 – Solderless Assembly Processes for Flexible Circuits
By Joseph Fjelstad
The European Union’ official ban on the use of lead in electronic solder under its Restriction of Hazardous Substances (RoHS) legislation has created a substantial challenge for electronics in terms of meeting cost and reliability demands. This has necessitated a new approach to manufacturing all types of electronic assemblies, including flexible circuits, without the use of solder and the development of new solder alloy free electronics (SAFE).
Chapter 12 provides a detailed look at solderless assembly processes and their many advantages. Additionally, it relates solderless assembly concepts specifically to flexible circuits and shows the almost unlimited future potential for this technology.