Chapter 15 – Plated Through-Hole Reliability
By Paul Reid
Plated through-hole reliability is a necessary element of every rigid, flex or rigid flex circuit. Chapter 15 supplies an overview of some of the more frequently used bare board level reliability tests that are performed to increase confidence that the finished product will perform to expectations. It includes a discussion of the various methods that augment such testing.
The chapter also offers a detailed review of accelerated reliability testing by means of thermal excursions brought on by current flow. This new method is reviewed in great depth, discussing test methods, test parameters, interpretation of results and failure modes. The chapter provides an comprehensive review of common defects supported by highly useful cross-sectional illustrations.